Electrically conductive tapes (ECT) can be an excellent solution for grounding, EMI shielding, and attaching components in a wide range of electronic applications. These specialized tapes have conductive filler particles that enable interconnection between substrates while also providing electrical insulation. ECTs are also very easy to use and integrate into the manufacturing process.
With an abundance of high-quality ECTs available in today’s market, how can you determine which one is best for your application? Answering these questions can help you narrow down to the optimal product.
The type and characteristics of the surface can influence your selection of ECT. Typical options include gold, stainless steel, copper, and scrim.
ECTs offer a range of contact resistance values, including <1, 1-5, 5-20, and >20 ohms. Products are also available with inherent bond line EMI shielding for effective grounding and prevention of device bias.
Where the device will be used and the environmental conditions it will be exposed to can alter the tape’s contact and adhesion performance.
Some ECTs have a higher degree of EMI shielding at the bond line. These are good options if your application requires additional signal protection, grounding performance, or reduced EMI affects.
Depending on the product, ECT adhesion can range from high-strength, good, or standard level that allows for easier rework and assembly.
ECTs are available in thicknesses from 1.5 to 8.0 mils to meet the defined gap requirements.
Time, temperature, and pressure should all be factored in when defining the optimal assembly method.
After evaluating your application, your materials and converting partner will be able to provide 2-3 options that meet your requirements and offer the most advantages. From there, the tapes should be tested and validated to ensure you have the best solution for your product.
At Tapecon, we have over 100 years of experience helping customers solve their complex product challenges. Learn more about our electronic materials applications.